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US Patent Issued to Tokyo Electron on April 7 for "Method of forming conductive member and method of forming channel" (Japanese Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,926, issued on April 7, was assigned to Tokyo Electron Ltd. (Tokyo). "Method of forming conductive member and method of forming channel" wa... Read More


US Patent Issued to The Government of the United States of America, as represented by the Secretary of the Navy on April 7 for "Methods of forming semiconductor devices including self-aligned p-type and n-type doped regions" (Maryland, Tennessee, Virginia Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,927, issued on April 7, was assigned to The Government of the United States of America, as represented by the Secretary of the Navy (Arlingt... Read More


US Patent Issued to ASM IP Holding on April 7 for "Apparatus and methods for selectively etching silicon oxide films" (Arizona Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,928, issued on April 7, was assigned to ASM IP Holding B.V. (Almere, Netherlands). "Apparatus and methods for selectively etching silicon o... Read More


US Patent Issued to Lam Research on April 7 for "Atomic layer etching of molybdenum" (California, Oregon, Hawaii Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,929, issued on April 7, was assigned to Lam Research Corp. (Fremont, Calif.). "Atomic layer etching of molybdenum" was invented by Andreas ... Read More


US Patent Issued to Lam Research on April 7 for "Conformal thermal CVD with controlled film properties and high deposition rate" (Oregon, California, Idaho Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,930, issued on April 7, was assigned to Lam Research Corp. (Fremont, Calif.). "Conformal thermal CVD with controlled film properties and hi... Read More


US Patent Issued to WINBOND ELECTRONICS on April 7 for "Semiconductor structure and method for forming the same" (Taiwanese Inventor)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,931, issued on April 7, was assigned to WINBOND ELECTRONICS CORP. (Taichung City, Taiwan). "Semiconductor structure and method for forming ... Read More


US Patent Issued to Tokyo Electron on April 7 for "Methods and structures for improving etch profile of underlying layers" (New York Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,932, issued on April 7, was assigned to Tokyo Electron Ltd. (Tokyo). "Methods and structures for improving etch profile of underlying layer... Read More


US Patent Issued to Tokyo Electron on April 7 for "Semiconductor devices and methods of manufacturing the same" (New York Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,933, issued on April 7, was assigned to Tokyo Electron Ltd. (Tokyo). "Semiconductor devices and methods of manufacturing the same" was inve... Read More


US Patent Issued to MIKRO MESA TECHNOLOGY on April 7 for "Method of manufacturing structure having multi metal layers" (Taiwanese Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,934, issued on April 7, was assigned to MIKRO MESA TECHNOLOGY Co. LTD. (Apia, Samoa). "Method of manufacturing structure having multi metal... Read More


US Patent Issued to DISCO on April 7 for "Chip manufacturing method using a laser beam with first and second focused points" (Japanese Inventor)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,936, issued on April 7, was assigned to DISCO Corp. (Tokyo). "Chip manufacturing method using a laser beam with first and second focused po... Read More