US Patent Issued to DISCO on April 7 for "Chip manufacturing method using a laser beam with first and second focused points" (Japanese Inventor)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,936, issued on April 7, was assigned to DISCO Corp. (Tokyo).

"Chip manufacturing method using a laser beam with first and second focused points" was invented by Jingshi Chi (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A chip manufacturing method for dividing a workpiece along a projected dicing line established thereon into a plurality of chips includes a modified layer forming step of applying a laser beam that is transmittable through the workpiece and focused into a first focused point and a second focused point, to the workpiece along the projected dicing line while positioning the first focused point and the second focused point within...