ALEXANDRIA, Va., March 31 -- United States Patent no. 12,593,598, issued on March 31, was assigned to Samsung Display Co. Ltd. (Yongin-si, South Korea). "Display apparatus having dam structures and a... Read More
ALEXANDRIA, Va., March 31 -- United States Patent no. D1,121,072, issued on March 31, was assigned to Krusader LLC (Ladera Ranch, Calif.). "Hockey goal trainer frame" was invented by Marko R. Zoretic... Read More
ALEXANDRIA, Va., March 31 -- United States Patent no. 12,591,100, issued on March 31, was assigned to NTT Inc. (Tokyo). "Optical cable laying method" was invented by Akira Sakurai (Musashino, Japan),... Read More
ALEXANDRIA, Va., March 31 -- United States Patent no. 12,591,989, issued on March 31, was assigned to Varjo Technologies Oy (Helsinki). "Method for depth estimation and head-mounted display" was inve... Read More
ALEXANDRIA, Va., March 31 -- United States Patent no. 12,590,888, issued on March 31, was assigned to KEIO UNIVERSITY (Tokyo). "Infrared analysis chip, and infrared imaging device" was invented by Hi... Read More
ALEXANDRIA, Va., March 31 -- United States Patent no. 12,589,543, issued on March 31, was assigned to KOCHER-PLASTIK MASCHINENBAU GMBH (Sulzbach-Laufen, Germany). "Method for producing a container pr... Read More
ALEXANDRIA, Va., March 31 -- United States Patent no. 12,592,488, issued on March 31, was assigned to Micro Mobio Corp. (Palo Alto, Calif.). "Antenna array panel for use in mobile devices" was invent... Read More
ALEXANDRIA, Va., March 31 -- United States Patent no. 12,590,245, issued on March 31, was assigned to Okinawa Institute of Science and Technology School Corp. (Onna-son, Japan). "Long-persistent lumi... Read More
ALEXANDRIA, Va., March 31 -- United States Patent no. 12,590,212, issued on March 31, was assigned to Sun Chemical Corp. (Parsippany, N.J.). "Method of improving actinic cure of energy curable inks a... Read More
ALEXANDRIA, Va., March 31 -- United States Patent no. 12,593,684, issued on March 31, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Semiconductor package including heat dissi... Read More