US Patent Issued to SAMSUNG ELECTRONICS on March 31 for "Semiconductor package including heat dissipation structure" (South Korean Inventors)

ALEXANDRIA, Va., March 31 -- United States Patent no. 12,593,684, issued on March 31, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Semiconductor package including heat dissipation structure" was invented by Myungsam Kang (Hwaseong-si, South Korea), Jeongseok Kim (Cheonan-si, South Korea) and Bongju Cho (Hwaseong-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a first rewiring layer; a lower semiconductor chip on the first rewiring layer; an upper semiconductor chip on the lower semiconductor chip; a heat dissipation structure on the upper semiconductor chip; a molding layer on the first rewiring layer so as to contact side surfaces of ...