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US Patent Issued to Sharp on April 7 for "Display device" (Japanese Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,875, issued on April 7, was assigned to Sharp K.K. (Sakai City, Japan). "Display device" was invented by Hirohide Mimura (Sakai City, Japan... Read More


US Patent Issued to HON HAI PRECISION INDUSTRY, Hon Young Semiconductor on April 7 for "Semiconductor device and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,770, issued on April 7, was assigned to HON HAI PRECISION INDUSTRY Co. LTD. (New Taipei City, Taiwan) and Hon Young Semiconductor Corp. (Hsi... Read More


US Patent Issued to ROHM on April 7 for "Silicon carbide semiconductor device with trench gate and dummy gate source structures" (Japanese Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,771, issued on April 7, was assigned to ROHM Co. LTD. (Kyoto, Japan). "Silicon carbide semiconductor device with trench gate and dummy gate... Read More


US Patent Issued to TEXAS INSTRUMENTS on April 7 for "Vertical trench gate fet with split gate" (Texas, Pennsylvania Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,772, issued on April 7, was assigned to TEXAS INSTRUMENTS Inc. (Dallas). "Vertical trench gate fet with split gate" was invented by Sunglyo... Read More


US Patent Issued to HITACHI ENERGY on April 7 for "Trench sic power semiconductor device" (Swiss Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,773, issued on April 7, was assigned to HITACHI ENERGY LTD (Zurich, Switzerland). "Trench sic power semiconductor device" was invented by M... Read More


US Patent Issued to SAMSUNG ELECTRONICS on April 7 for "Semiconductor devices" (South Korean Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,774, issued on April 7, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Semiconductor devices" was invented by Jongc... Read More


US Patent Issued to Taiwan Semiconductor Manufacturing on April 7 for "Source/drains in semiconductor devices and methods of forming thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,775, issued on April 7, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Source/drains in semiconductor devi... Read More


US Patent Issued to International Business Machines on April 7 for "Nanosheet epitaxy with full bottom isolation" (New York Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,776, issued on April 7, was assigned to International Business Machines Corp. (Armonk, N.Y.). "Nanosheet epitaxy with full bottom isolation... Read More


US Patent Issued to Intel on April 7 for "Low temperature, high germanium, high boron SiGe:B pEPI with titanium silicide contacts for ultra-low PMOS contact resistivity and thermal stability" (Oregon, Maryland Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,777, issued on April 7, was assigned to Intel Corp. (Santa Clara, Calif.). "Low temperature, high germanium, high boron SiGe:B pEPI with ti... Read More


US Patent Issued to INSTITUTE OF MICROELECTRONICS. CHINESE ACADEMY OF SCIENCES on April 7 for "Semiconductor device, method for manufacturing semiconductor device, and electronic apparatus including the semiconductor device" (New York Inventor)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,778, issued on April 7, was assigned to INSTITUTE OF MICROELECTRONICS. CHINESE ACADEMY OF SCIENCES (Beijing). "Semiconductor device, method... Read More