ALEXANDRIA, Va., April 21 -- United States Patent no. 12,606,713, issued on April 21, was assigned to E Ink Corp. (Billerica, Mass.). "Electrophoretic media including charge control agents comprising... Read More
ALEXANDRIA, Va., April 21 -- United States Patent no. 12,606,714, issued on April 21, was assigned to CHINA JILIANG UNIVERSITY (Hangzhou City, China). "Self-diagnosis and self-repair intelligent coat... Read More
ALEXANDRIA, Va., April 21 -- United States Patent no. 12,606,715, issued on April 21, was assigned to MITSUBISHI PENCIL COMPANY Ltd. (Shinagawa-ku, Japan). "Aqueous ink composition for writing instru... Read More
ALEXANDRIA, Va., April 21 -- United States Patent no. 12,606,716, issued on April 21, was assigned to Hewlett-Packard Development Co. LP (Spring, Texas). "Biocide composition" was invented by Ravi Sh... Read More
ALEXANDRIA, Va., April 21 -- United States Patent no. 12,606,718, issued on April 21, was assigned to FUJIMI Inc. (Kiyosu, Japan). "Polishing composition, polishing method, and method of manufacturin... Read More
ALEXANDRIA, Va., April 21 -- United States Patent no. 12,606,719, issued on April 21, was assigned to Femasys Inc. (Suwanee, Ga.). "Methods and compositions comprising biodegradable cyanoacrylates" w... Read More
ALEXANDRIA, Va., April 21 -- United States Patent no. 12,606,720, issued on April 21, was assigned to CORNING Inc. (Corning, N.Y.). "Temporary sheet bonding method and apparatus" was invented by Boky... Read More
ALEXANDRIA, Va., April 21 -- United States Patent no. 12,606,721, issued on April 21, was assigned to Dai Nippon Printing Co. Ltd. (Tokyo). "Foaming adhesive sheet and method for producing product" w... Read More
ALEXANDRIA, Va., April 21 -- United States Patent no. 12,606,722, issued on April 21, was assigned to In-Tuition LLC (Holualoa, Hawaii). "Nested masking tape rolls" was invented by Robert Paul Calvo ... Read More
ALEXANDRIA, Va., April 21 -- United States Patent no. 12,606,723, issued on April 21, was assigned to KYOCERA Corp. (Kyoto, Japan). "Thermosetting resin composition, semiconductor device and electric... Read More