US Patent Issued to FUJIMI on April 21 for "Polishing composition, polishing method, and method of manufacturing semiconductor substrate" (Japanese Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,606,718, issued on April 21, was assigned to FUJIMI Inc. (Kiyosu, Japan).

"Polishing composition, polishing method, and method of manufacturing semiconductor substrate" was invented by Ryota Mae (Kiyosu, Japan), Akane Kumayama (Kiyosu, Japan) and Masaki Tada (Kiyosu, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a means capable of polishing an organic material at a high polishing speed and reducing the number of scratches after polishing. The polishing composition of the present invention contains zirconia particles and a dispersing medium, in which the zirconia particles contain at least one of tetragonal zirconia and cubic zirconia...