ALEXANDRIA, Va., April 21 -- United States Patent no. 12,606,720, issued on April 21, was assigned to CORNING Inc. (Corning, N.Y.).
"Temporary sheet bonding method and apparatus" was invented by Bokyung Kong (Hwasung-city, South Korea), JooYoung Lee (Asan-si, South Korea), Joohye Oh (Cheonan-si, South Korea), Yujin Shin (Asan-si, South Korea) and Kwangje Woo (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A temporary sheet bonding method includes dip-coating temporary bonding layer 200 on a first sheet 100 by dipping the first sheet into a bonding solution comprising a surfactant and temporarily bonding the second sheet 300 to the first sheet via the temporary bonding layer. The surfact...