ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,573, issued on Oct. 27, was assigned to NVIDIA Corp. (Santa Clara, Calif.). "Slot ground for improved signal integrity" was invented by Tib... Read More
ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,574, issued on Oct. 27, was assigned to NVIDIA Corp. (Santa Clara, Calif.). "Coaxial ground shield for improved signal integrity" was inven... Read More
ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,575, issued on Oct. 27, was assigned to NOKOMIS INC.. "Electronic device and methods to customize electronic device electromagnetic emissio... Read More
ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,576, issued on Oct. 27, was assigned to Dell Products LP (Round Rock, Texas). "Dual differential via design on a printed circuit board" was... Read More
ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,577, issued on Oct. 27, was assigned to Hong QiSheng Precision Electronics (QinHuang Dao) Co. Ltd. (Qinhuangdao, China), Avary Holding (Shen... Read More
ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,578, issued on Oct. 27, was assigned to CHENGDU BOE OPTOELECTRONICS TECHNOLOGY Co. LTD. (Chengdu, China) and BEIJING BOE TECHNOLOGY DEVELOPM... Read More
ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,579, issued on Oct. 27, was assigned to LG INNOTEK Co. LTD. (Seoul, South Korea). "Circuit board and antenna device comprising same" was in... Read More
ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,580, issued on Oct. 27, was assigned to SIGNIFY HOLDING B.V. (Eindhoven, Netherlands). "Shared footprint for frontside and through-board co... Read More
ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,581, issued on Oct. 27, was assigned to Unimicron Technology Corp. (Taoyuan City, Taiwan). "Circuit board structure and manufacturing metho... Read More
ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,582, issued on Oct. 27, was assigned to MURATA MANUFACTURING Co. LTD. (Kyoto, Japan). "Multilayer substrate" was invented by Tomonori Katsu... Read More