US Patent Issued to Unimicron Technology on Oct. 27 for "Circuit board structure and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,581, issued on Oct. 27, was assigned to Unimicron Technology Corp. (Taoyuan City, Taiwan).

"Circuit board structure and manufacturing method thereof" was invented by Kai-Ming Yang (Hsinchu County, Taiwan), Chen-Hao Lin (Keelung City, Taiwan), Chin-Sheng Wang (Taoyuan City, Taiwan), Cheng-Ta Ko (Taipei City, Taiwan) and Pu-Ju Lin (Hsinchu City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The invention provides a circuit board structure and a manufacturing method thereof. The circuit board structure includes a line portion, a first insulating layer, and a conductive terminal. The first insulating layer is disposed on the line portion. The co...