US Patent Issued to MURATA MANUFACTURING on Oct. 27 for "Multilayer substrate" (Japanese Inventors)

ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,582, issued on Oct. 27, was assigned to MURATA MANUFACTURING Co. LTD. (Kyoto, Japan).

"Multilayer substrate" was invented by Tomonori Katsura (Nagaokakyo, Japan) and Kouki Shimizu (Nagaokakyo, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A multilayer substrate includes a multilayer body that includes plastic resin layers and a space inside the multilayer body, a first inner layer resin in the space, and conductors that include a signal conductor and are located on the first inner layer resin, in which at least a portion of the first inner layer resin is separated from the multilayer body in the space."

The patent was filed on July 16, 2024,...