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US Patent Issued to HONGQISHENG PRECISION ELECTRONICS (QINHUANGDAO), AVARY HOLDING (SHENZHEN), GARUDA TECHNOLOGY on Oct. 20 for "Circuit board having a switch and method for fabricating the same" (Chinese Inventor)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,772,374, issued on Oct. 20, was assigned to HONGQISHENG PRECISION ELECTRONICS (QINHUANGDAO) Co. LTD. (Hebei Province, China), AVARY HOLDING (SHE... और पढ़ें


US Patent Issued to SAMSUNG ELECTRO-MECHANICS on Oct. 20 for "Printed circuit board" (South Korean Inventors)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,772,375, issued on Oct. 20, was assigned to SAMSUNG ELECTRO-MECHANICS Co. LTD. (Suwon-si, South Korea). "Printed circuit board" was invented by... और पढ़ें


US Patent Issued to LOTTE ENERGY MATERIALS CORPORATON on Oct. 20 for "Surface-treated copper foil with heat resistance, and copper clad laminate and printed wiring board including the same" (South Korean Inventors)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,772,376, issued on Oct. 20, was assigned to LOTTE ENERGY MATERIALS CORPORATON (Jeollabuk-do, South Korea). "Surface-treated copper foil with he... और पढ़ें


US Patent Issued to SAMSUNG ELECTRO-MECHANICS on Oct. 20 for "Printed circuit board and method of manufacturing the same" (South Korean Inventors)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,772,377, issued on Oct. 20, was assigned to SAMSUNG ELECTRO-MECHANICS Co. LTD. (Suwon-si, South Korea). "Printed circuit board and method of ma... और पढ़ें


US Patent Issued to IBIDEN on Oct. 20 for "Wiring substrate having multiple build-up parts" (Japanese Inventors)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,772,378, issued on Oct. 20, was assigned to IBIDEN Co. Ltd. (Ogaki, Japan). "Wiring substrate having multiple build-up parts" was invented by M... और पढ़ें


US Patent Issued to TOPPAN HOLDINGS on Oct. 20 for "Glass substrate, through-electrode, multilayer wiring substrate, and glass substrate manufacturing method" (Japanese Inventor)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,772,379, issued on Oct. 20, was assigned to TOPPAN HOLDINGS INC. (Tokyo). "Glass substrate, through-electrode, multilayer wiring substrate, and... और पढ़ें


US Patent Issued to HELLA on Oct. 20 for "Circuit system and method for radar, lidar, or camera systems" (German Inventor)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,772,380, issued on Oct. 20, was assigned to HELLA GmbH & Co. KGaA (Lippstadt, Germany). "Circuit system and method for radar, lidar, or camera ... और पढ़ें


US Patent Issued to Snap on Oct. 20 for "Corner shield protection for surface mount devices" (Illinois, California Inventors)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,772,381, issued on Oct. 20, was assigned to Snap Inc. (Santa Monica, Calif.). "Corner shield protection for surface mount devices" was invented... और पढ़ें


US Patent Issued to ALPS ALPINE on Oct. 20 for "Restricting device for flexible wiring board and display device using the restricting device" (Japanese Inventors)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,772,382, issued on Oct. 20, was assigned to ALPS ALPINE Co. LTD. (Tokyo). "Restricting device for flexible wiring board and display device usin... और पढ़ें


US Patent Issued to Hewlett Packard Enterprise Development on Oct. 20 for "Apparatus, system, and method for backdrilling vias based on depth measurements taken during primary drilling applications" (Massachusetts Inventor)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,772,383, issued on Oct. 20, was assigned to Hewlett Packard Enterprise Development LP (Spring, Texas). "Apparatus, system, and method for backd... और पढ़ें