ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,772,377, issued on Oct. 20, was assigned to SAMSUNG ELECTRO-MECHANICS Co. LTD. (Suwon-si, South Korea).
"Printed circuit board and method of manufacturing the same" was invented by Sang Ho Jeong (Suwon-si, South Korea), Jong Eun Park (Suwon-si, South Korea), Chang Hwa Park (Suwon-si, South Korea) and Hyun Hu Lee (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A printed circuit board and a method of manufacturing the same are provided. The printed circuit board includes a first insulating layer, a first metal layer disposed on an upper side of the first insulating layer, a second metal layer disposed on a lower side of the first ins...