US Patent Issued to IBIDEN on Oct. 20 for "Wiring substrate having multiple build-up parts" (Japanese Inventors)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,772,378, issued on Oct. 20, was assigned to IBIDEN Co. Ltd. (Ogaki, Japan).

"Wiring substrate having multiple build-up parts" was invented by Masashi Kuwabara (Ibi-gun, Japan) and Susumu Kagohashi (Ogaki, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A wiring substrate includes a first build-up part including first insulating and conductor layers, and via conductors, and a second build-up part including second insulating and conductor layers. The first build-up part is laminated on the second build-up part. The minimum wiring width of wirings in the first conductor layers is smaller than the minimum wiring width of wirings in the second conductor...