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US Patent Issued to Snap on Oct. 20 for "Corner shield protection for surface mount devices" (Illinois, California Inventors)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,772,381, issued on Oct. 20, was assigned to Snap Inc. (Santa Monica, Calif.). "Corner shield protection for surface mount devices" was invented... Read More


US Patent Issued to ALPS ALPINE on Oct. 20 for "Restricting device for flexible wiring board and display device using the restricting device" (Japanese Inventors)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,772,382, issued on Oct. 20, was assigned to ALPS ALPINE Co. LTD. (Tokyo). "Restricting device for flexible wiring board and display device usin... Read More


US Patent Issued to Hewlett Packard Enterprise Development on Oct. 20 for "Apparatus, system, and method for backdrilling vias based on depth measurements taken during primary drilling applications" (Massachusetts Inventor)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,772,383, issued on Oct. 20, was assigned to Hewlett Packard Enterprise Development LP (Spring, Texas). "Apparatus, system, and method for backd... Read More


US Patent Issued to IBIDEN on Oct. 20 for "Method for manufacturing wiring substrate" (Japanese Inventor)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,772,384, issued on Oct. 20, was assigned to IBIDEN Co. Ltd. (Ogaki, Japan). "Method for manufacturing wiring substrate" was invented by Yasushi... Read More


US Patent Issued to Unimicron Technology on Oct. 20 for "Circuit board structure and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,772,385, issued on Oct. 20, was assigned to Unimicron Technology Corp. (Taoyuan City, Taiwan). "Circuit board structure and manufacturing metho... Read More


US Patent Issued to LG ENERGY SOLUTION on Oct. 20 for "Circuit board assembly manufacturing method, circuit board assembly manufactured by same, and electric vehicle including same" (South Korean Inventors)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,772,386, issued on Oct. 20, was assigned to LG ENERGY SOLUTION LTD. (Seoul, South Korea). "Circuit board assembly manufacturing method, circuit... Read More


US Patent Issued to FUJI on Oct. 20 for "Liquid transfer device for forming liquid film on a surface of a transfer table" (Japanese Inventors)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,772,387, issued on Oct. 20, was assigned to FUJI Corp. (Chiryu, Japan). "Liquid transfer device for forming liquid film on a surface of a trans... Read More


US Patent Issued to Phoenix Pioneer Technology on Oct. 20 for "Package carrier core layer structure integrated with magnetic element structure" (Taiwanese Inventor)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,772,388, issued on Oct. 20, was assigned to Phoenix Pioneer Technology Co. Ltd. (Hsinchu County, Taiwan). "Package carrier core layer structure... Read More


US Patent Issued to DAIWA on Oct. 20 for "Method for manufacturing wiring board or wiring board material" (Japanese Inventor)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,772,389, issued on Oct. 20, was assigned to DAIWA Co. LTD. (Nagano, Japan). "Method for manufacturing wiring board or wiring board material" wa... Read More


US Patent Issued to AT&S Austria Technologie & Systemtechnik on Oct. 20 for "Component carrier with magnetic element, magnetic inlay, and manufacturing method" (Austrian Inventors)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,772,390, issued on Oct. 20, was assigned to AT&S Austria Technologie & Systemtechnik AG (Leoben, Austria). "Component carrier with magnetic ele... Read More