ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,702,029, issued on Aug. 4, was assigned to Huawei Technologies'Co.'Ltd.' (Shenzhen, China). "Ground pin package substrate, semiconductor device,... Read More
ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,702,030, issued on Aug. 4, was assigned to Hyundai Motor Co. (Seoul, South Korea) and Kia Corp. (Seoul, South Korea). "Power module and method f... Read More
ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,702,031, issued on Aug. 4, was assigned to ROBERT BOSCH GMBH (Stuttgart, Germany). "Power module" was invented by Gunnar Bruns (Neumuenster, Ger... Read More
ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,702,032, issued on Aug. 4, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor package and display apparatus in... Read More
ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,702,033, issued on Aug. 4, was assigned to Advanced Semiconductor Engineering Inc. (Kaohsiung, Taiwan). "Electronic device" was invented by Chiu... Read More
ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,702,034, issued on Aug. 4, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Semiconductor package and method of manufactur... Read More
ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,702,035, issued on Aug. 4, was assigned to Advanced Micro Devices Inc. (Santa Clara, Calif.). "Chip package with embedded and shielded inductors... Read More
ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,702,036, issued on Aug. 4, was assigned to Intel Corp. (Santa Clara, Calif.). "Ultra low loss routing between glass cores" was invented by Arghy... Read More
ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,702,037, issued on Aug. 4, was assigned to Yamaha Robotics Co. Ltd. (Tokyo). "Bonding apparatus, bonding method, and computer readable storage m... Read More
ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,702,038, issued on Aug. 4, was assigned to ASMPT Singapore Pte. Ltd. (Singapore). "System and method for fluxless thermocompression bonding" was... Read More