US Patent Issued to Advanced Micro Devices on Aug. 4 for "Chip package with embedded and shielded inductors" (Texas Inventors)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,702,035, issued on Aug. 4, was assigned to Advanced Micro Devices Inc. (Santa Clara, Calif.).

"Chip package with embedded and shielded inductors" was invented by Robert Grant Spurney (Austin, Texas) and Sri Ranga Sai Boyapati (Austin, Texas).

According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed herein are a package substrate, a chip package, and method for fabricating the same. The package substrate includes a package core comprising vias; a plurality of build-up layers disposed on an upper surface of the package core, the plurality of build-up layers comprising metal traces connected with the vias; and a magnetic core inductor disposed in a cavity of ...