US Patent Issued to Huawei Technologies'Co., 'Ltd.' on Aug. 4 for "Ground pin package substrate, semiconductor device, and electronic device" (Chinese Inventors)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,702,029, issued on Aug. 4, was assigned to Huawei Technologies'Co.'Ltd.' (Shenzhen, China).

"Ground pin package substrate, semiconductor device, and electronic device" was invented by Xiping Peng (Dongguan, China) and Zhenhua Yuan (Shenzhen, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package substrate includes a substrate body and a plurality of unit regions disposed on the substrate body. The unit region includes two first solder ball structures. The first solder ball structure includes six first solder balls. The six first solder balls are arranged, with two of them in a row, to form three parallel rows of two solder balls: a first row of s...