ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,928, issued on Aug. 11, was assigned to ENTEGRIS INC. (Billerica, Mass.). "Substrate container with mechanically actuated exhaust valve" wa... Read More
ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,929, issued on Aug. 11, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Method of cleaning a nozzle" wa... Read More
ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,930, issued on Aug. 11, was assigned to SHIBAURA MECHATRONICS Corp. (Kanagawa, Japan). "Wafer storage container processing apparatus" was i... Read More
ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,931, issued on Aug. 11, was assigned to NITERRA Co. LTD. (Nagoya, Japan). "Substrate holder" was invented by Kazuya Takahashi (Nagoya, Japa... Read More
ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,932, issued on Aug. 11, was assigned to Intel Corp. (Santa Clara, Calif.). "Handling assembly, handling system and method" was invented by ... Read More
ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,933, issued on Aug. 11, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "Semiconductor substrate chucking sensor" was invente... Read More
ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,934, issued on Aug. 11, was assigned to Tianma Advanced Display Technology Institute (Xiamen) Co. Ltd. (Xiamen, China). "Microdevice substr... Read More
ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,935, issued on Aug. 11, was assigned to WUHAN XINXIN SEMICONDUCTOR MANUFACTURING Co. LTD. (Wuhan, China). "Chip bonding method" was invente... Read More
ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,936, issued on Aug. 11, was assigned to Tokyo Electron Ltd. (Tokyo). "Substrate processing method and substrate processing apparatus" was i... Read More
ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,937, issued on Aug. 11, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Wafer release mechanism" was invent... Read More