Exclusive

Publication

Byline

Location

US Patent Issued to City University of Hong Kong on Aug. 25 for "Versatile anti-ambipolar phototransistors based on mixed-dimensional heterojunctions" (Chinese Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,720,877, issued on Aug. 25, was assigned to City University of Hong Kong (Hong Kong). "Versatile anti-ambipolar phototransistors based on mixed... Read More


US Patent Issued to Sony Semiconductor Solutions on Aug. 25 for "Imaging element package, method of manufacturing the same, and electronic device" (Japanese Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,720,878, issued on Aug. 25, was assigned to Sony Semiconductor Solutions Corp. (Kanagawa, Japan). "Imaging element package, method of manufactu... Read More


US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Aug. 25 for "Semiconductor structure of backside illumination CMOS image sensor and method for forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,720,879, issued on Aug. 25, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Semiconductor structure of back... Read More


US Patent Issued to Hua Hong Semiconductor (Wuxi) on Aug. 25 for "Method for forming backside illumination CMOS image sensor" (Chinese Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,720,880, issued on Aug. 25, was assigned to Hua Hong Semiconductor (Wuxi) Ltd. (Wuxi, China). "Method for forming backside illumination CMOS im... Read More


US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Aug. 25 for "Back side illuminated image sensor with reduced sidewall-induced leakage" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,720,881, issued on Aug. 25, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Back side illuminated image sen... Read More


US Patent Issued to Magnolia White on Aug. 25 for "Optical detection device including initialization circuit configured to improve detection accuracy" (Japanese Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,720,882, issued on Aug. 25, was assigned to Magnolia White Corp. (Tokyo). "Optical detection device including initialization circuit configured... Read More


US Patent Issued to OLYMPUS on Aug. 25 for "Image pickup unit, endoscope, and method for manufacturing image pickup unit" (Japanese Inventor)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,720,883, issued on Aug. 25, was assigned to OLYMPUS Corp. (Tokyo). "Image pickup unit, endoscope, and method for manufacturing image pickup uni... Read More


US Patent Issued to Beijing BOE Sensor Technology, BOE Technology Group on Aug. 25 for "Ridge recognition substrate and ridge recognition apparatus" (Chinese Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,720,884, issued on Aug. 25, was assigned to Beijing BOE Sensor Technology Co. Ltd. (Beijing) and BOE Technology Group Co. Ltd. (Beijing). "Ridg... Read More


US Patent Issued to Taiwan Semiconductor Manufacturing on Aug. 25 for "Image sensor and method of manufacturing the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,720,885, issued on Aug. 25, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Image sensor and method of manufact... Read More


US Patent Issued to SAMSUNG ELECTRONICS on Aug. 25 for "Image sensor and electronic system including the same" (South Korean Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,720,886, issued on Aug. 25, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Image sensor and electronic system including... Read More