US Patent Issued to Sony Semiconductor Solutions on Aug. 25 for "Imaging element package, method of manufacturing the same, and electronic device" (Japanese Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,720,878, issued on Aug. 25, was assigned to Sony Semiconductor Solutions Corp. (Kanagawa, Japan).

"Imaging element package, method of manufacturing the same, and electronic device" was invented by Yuji Hara (Kumamoto, Japan) and Kosuke Hareyama (Kanagawa, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure relates to an imaging element package, a method of manufacturing the same, and an electronic device capable of further improving reliability. An imaging element package includes a solid-state imaging element having a first pad, a substrate on which the solid-state imaging element is mounted, the substrate having a second pad, a...