ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,199, issued on Aug. 25, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Semiconductor package" was invented by Giseu... Read More
ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,200, issued on Aug. 25, was assigned to IBIDEN Co. Ltd. (Ogaki, Japan). "Wiring substrate" was invented by Toshiki Furutani (Ibi-gun, Japan... Read More
ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,201, issued on Aug. 25, was assigned to LG INNOTEK Co. LTD. (Seoul, South Korea). "Circuit board and semiconductor package having the same"... Read More
ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,202, issued on Aug. 25, was assigned to Intel Corp. (Santa Clara, Calif.). "Deformable semiconductor device connection" was invented by Onu... Read More
ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,203, issued on Aug. 25. "Solder paste, method for forming solder bumps, and method for manufacturing member provided with solder bumps" was... Read More
ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,204, issued on Aug. 25, was assigned to Advanced Semiconductor Engineering Inc. (Kaohsiung, Taiwan). "Method for manufacturing a package st... Read More
ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,205, issued on Aug. 25, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Solder reflow apparatus and method of manufa... Read More
ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,206, issued on Aug. 25, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsin-chu, Taiwan). "Bump-on-trace design for enlarge b... Read More
ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,207, issued on Aug. 25, was assigned to HITACHI POWER SEMICONDUCTOR DEVICE LTD. (Ibaraki, Japan). "Semiconductor device including semicondu... Read More
ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,208, issued on Aug. 25, was assigned to Nippon Micrometal Corp. (Saitama, Japan). "Bonding wire for semiconductor devices" was invented by ... Read More