US Patent Issued to SAMSUNG ELECTRONICS on Aug. 25 for "Semiconductor package" (South Korean Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,199, issued on Aug. 25, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Semiconductor package" was invented by Giseung Heo (Suwon-si, South Korea), Seonkyu Kim (Suwon-si, South Korea), Joonseok Oh (Suwon-si, South Korea), Kyunghee Lee (Suwon-si, South Korea) and Junghyun Cho (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes; a first redistribution structure, a chip disposed on the first redistribution structure, and a package body disposed on the first redistribution structure and covering opposing side surfaces of the chip. The first redistribution structure includes; a ver...