US Patent Issued to LG INNOTEK on Aug. 25 for "Circuit board and semiconductor package having the same" (South Korean Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,201, issued on Aug. 25, was assigned to LG INNOTEK Co. LTD. (Seoul, South Korea).

"Circuit board and semiconductor package having the same" was invented by Su Min Lee (Seoul, South Korea), Dae Young Ku (Seoul, South Korea), Ji Hoon Kim (Seoul, South Korea), Dae Sung Moon (Seoul, South Korea), Byung Wook Woo (Seoul, South Korea), Chang Woo Yoo (Seoul, South Korea), Sang Hyun Lee (Seoul, South Korea) and Ju Hyun Lee (Seoul, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A circuit board includes a build-up structure including a plurality of insulating layers stacked along a vertical direction; a solder resist layer disposed on the build-up ...