US Patent Issued to SAMSUNG ELECTRONICS on Aug. 25 for "Semiconductor data storage device including first and second stack structures with dummy structure therebetween and data storage system including the same" (South Korean Inventors)

Posted On: 2026-08-25

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,720,741, issued on Aug. 25, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor data storage device including ... Read More

US Patent Issued to SAMSUNG ELECTRONICS on Aug. 25 for "Semiconductor device including bit line pad, method for manufacturing the same and electronic system including the same" (South Korean Inventors)

Posted On: 2026-08-25

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ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,720,742, issued on Aug. 25, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor device including bit line pad,... Read More

US Patent Issued to Micron Technology on Aug. 25 for "Memory array and method used in forming a memory array comprising strings of memory cells" (Idaho Inventors)

Posted On: 2026-08-25

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ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,720,743, issued on Aug. 25, was assigned to Micron Technology Inc. (Boise, Idaho). "Memory array and method used in forming a memory array comp... Read More

US Patent Issued to SK hynix on Aug. 25 for "Manufacturing method of semiconductor device" (South Korean Inventor)

Posted On: 2026-08-25

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ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,720,744, issued on Aug. 25, was assigned to SK hynix Inc. (Icheon-si, South Korea). "Manufacturing method of semiconductor device" was invented... Read More

US Patent Issued to SAMSUNG ELECTRONICS on Aug. 25 for "Semiconductor memory device, method of fabricating the same, and electronic system including the same" (South Korean Inventors)

Posted On: 2026-08-25

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ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,720,745, issued on Aug. 25, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Semiconductor memory device, method of fabri... Read More

US Patent Issued to Sandisk Technologies on Aug. 25 for "Three-dimensional memory device including backside semiconductor source structure and methods for forming the same" (California Inventors)

Posted On: 2026-08-25

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ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,720,746, issued on Aug. 25, was assigned to Sandisk Technologies Inc. (Milpitas, Calif.). "Three-dimensional memory device including backside s... Read More

US Patent Issued to Sandisk Technologies on Aug. 25 for "Three-dimensional memory device with reduced neighboring word line interference and methods of forming the same" (California Inventors)

Posted On: 2026-08-25

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ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,720,747, issued on Aug. 25, was assigned to Sandisk Technologies Inc. (Milpitas, Calif.). "Three-dimensional memory device with reduced neighbo... Read More

US Patent Issued to Sandisk Technologies on Aug. 25 for "Three-dimensional memory device containing silicon oxycarbide liners and methods of forming the same" (Japanese Inventors)

Posted On: 2026-08-25

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ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,720,748, issued on Aug. 25, was assigned to Sandisk Technologies Inc. (Milpitas, Calif.). "Three-dimensional memory device containing silicon o... Read More

US Patent Issued to Micron Technology on Aug. 25 for "Integrated assemblies, and methods of forming integrated assemblies" (Idaho Inventors)

Posted On: 2026-08-25

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ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,720,749, issued on Aug. 25, was assigned to Micron Technology Inc. (Boise, Idaho). "Integrated assemblies, and methods of forming integrated as... Read More

US Patent Issued to SAMSUNG ELECTRONICS on Aug. 25 for "Semiconductor device and method for manufacturing the same, and electronic system including semiconductor device" (South Korean Inventors)

Posted On: 2026-08-25

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ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,720,750, issued on Aug. 25, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea). "Semiconductor device and method for manuf... Read More

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US Patent Issued to SAMSUNG ELECTRONICS on Aug. 25 for "Semiconductor data storage device including first and second stack structures with dummy structure therebetween and data storage system including the same" (South Korean Inventors)

US Patent Issued to SAMSUNG ELECTRONICS on Aug. 25 for "Semiconductor device including bit line pad, method for manufacturing the same and electronic system including the same" (South Korean Inventors)

US Patent Issued to Micron Technology on Aug. 25 for "Memory array and method used in forming a memory array comprising strings of memory cells" (Idaho Inventors)

US Patent Issued to SK hynix on Aug. 25 for "Manufacturing method of semiconductor device" (South Korean Inventor)

US Patent Issued to SAMSUNG ELECTRONICS on Aug. 25 for "Semiconductor memory device, method of fabricating the same, and electronic system including the same" (South Korean Inventors)

US Patent Issued to Sandisk Technologies on Aug. 25 for "Three-dimensional memory device including backside semiconductor source structure and methods for forming the same" (California Inventors)

US Patent Issued to Sandisk Technologies on Aug. 25 for "Three-dimensional memory device with reduced neighboring word line interference and methods of forming the same" (California Inventors)

US Patent Issued to Sandisk Technologies on Aug. 25 for "Three-dimensional memory device containing silicon oxycarbide liners and methods of forming the same" (Japanese Inventors)

US Patent Issued to Micron Technology on Aug. 25 for "Integrated assemblies, and methods of forming integrated assemblies" (Idaho Inventors)

US Patent Issued to SAMSUNG ELECTRONICS on Aug. 25 for "Semiconductor device and method for manufacturing the same, and electronic system including semiconductor device" (South Korean Inventors)