US Patent Issued to Micron Technology on Aug. 25 for "Integrated assemblies, and methods of forming integrated assemblies" (Idaho Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,720,749, issued on Aug. 25, was assigned to Micron Technology Inc. (Boise, Idaho).

"Integrated assemblies, and methods of forming integrated assemblies" was invented by Anilkumar Chandolu (Boise, Idaho) and Indra V. Chary (Boise, Idaho).

According to the abstract* released by the U.S. Patent & Trademark Office: "Some embodiments include a method of forming an integrated assembly. Laterally alternating first and second sacrificial materials are formed over a conductive structure, and then a stack of vertically alternating first and second levels is formed over the sacrificial materials. The first levels include first material and the second levels include insulative second material. C...