ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,720,671, issued on Aug. 25, was assigned to Rockwell Collins Inc. (Cedar Rapids, Iowa). "Selective removal of adhesive from coverlay for printe... Read More
ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,720,672, issued on Aug. 25, was assigned to Advanced Semiconductor Engineering Inc. (Kaohsiung, Taiwan). "Electronic devices" was invented by W... Read More
ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,720,673, issued on Aug. 25, was assigned to Intel Corp. (Santa Clara, Calif.). "Methods and apparatus to increase rigidity of printed circuit b... Read More
ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,720,674, issued on Aug. 25, was assigned to Innolux Corp. (Miaoli County, Taiwan). "Electronic device" was invented by Ju-Li Wang (Miaoli Count... Read More
ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,720,675, issued on Aug. 25, was assigned to Kuprion Inc. (Waterbury, Conn.). "Metal-coated substrates, interposers, and methods for production ... Read More
ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,720,676, issued on Aug. 25, was assigned to Chengdu BOE Optoelectronics Technology Co. Ltd. (Chengdu, China) and BOE Technology Group Co. Ltd. (... Read More
ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,720,677, issued on Aug. 25, was assigned to NITTO DENKO Corp. (Osaka, Japan). "Wiring circuit board and wiring circuit board assembly sheet" wa... Read More
ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,720,678, issued on Aug. 25, was assigned to Apple Inc. (Cupertino, Calif.). "Compact interface through hinge connector" was invented by Parin R... Read More
ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,720,679, issued on Aug. 25, was assigned to CelLink Corp. (San Carlos, Calif.). "Flexible interconnect circuits comprising welded connections" ... Read More
ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,720,680, issued on Aug. 25, was assigned to Amphenol Corp. (Wallingford, Conn.). "Mating backplane for high speed, high density electrical conn... Read More