US Patent Issued to Rockwell Collins on Aug. 25 for "Selective removal of adhesive from coverlay for printed circuit board insulation" (Wisconsin, Iowa Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,720,671, issued on Aug. 25, was assigned to Rockwell Collins Inc. (Cedar Rapids, Iowa).

"Selective removal of adhesive from coverlay for printed circuit board insulation" was invented by John A. Bauer (Marion, Iowa) and Robert C. Cooney (Janesville, Wis.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A circuit board system includes a printed circuit board (PCB) having a first side and a second side opposite the first side. A plurality of plated through holes (PTHs) are defined through the PCB from the first side to the second side. A respective pad is defined at each end of each PTH of the plurality of PTHs. The PCB includes circuit traces electrically ...