US Patent Issued to Amphenol on Aug. 25 for "Mating backplane for high speed, high density electrical connector" (New Hampshire, Massachusetts Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,720,680, issued on Aug. 25, was assigned to Amphenol Corp. (Wallingford, Conn.).

"Mating backplane for high speed, high density electrical connector" was invented by Marc B. Cartier Jr. (Durham, N.H.), Mark W. Gailus (Concord, Mass.), David Levine (Amherst, N.H.) and Vysakh Sivarajan (Nashua, N.H.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A printed circuit board includes: a plurality of layers including attachment layers and routing layers; and via patterns formed in one or more of the plurality of layers, each of the via patterns including: first and second signal vias configured to accept contact tails of signal conductors of a connector; ground ...