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US Patent Issued to SAMSUNG ELECTRONICS on Nov. 3 for "Semiconductor device" (South Korean Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,304, issued on Nov. 3, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor device" was invented by Hodae Ki... Read More


US Patent Issued to SAMSUNG ELECTRONICS on Nov. 3 for "Stack semiconductor package" (South Korean Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,305, issued on Nov. 3, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Stack semiconductor package" was invented by H... Read More


US Patent Issued to Kioxia on Nov. 3 for "Semiconductor memory device with a plurality of wiring layers" (Japanese Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,306, issued on Nov. 3, was assigned to Kioxia Corp. (Tokyo). "Semiconductor memory device with a plurality of wiring layers" was invented by... Read More


US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Nov. 3 for "Structure and method for deep trench capacitor" (Taiwanese Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,307, issued on Nov. 3, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Structure and method for deep tre... Read More


US Patent Issued to Taiwan Semiconductor Manufacturing on Nov. 3 for "Semiconductor device" (Taiwanese Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,308, issued on Nov. 3, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Semiconductor device" was invented by... Read More


US Patent Issued to ROHM on Nov. 3 for "Semiconductor device and method for manufacturing same" (Japanese Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,309, issued on Nov. 3, was assigned to ROHM Co. LTD. (Kyoto, Japan). "Semiconductor device and method for manufacturing same" was invented b... Read More


US Patent Issued to Lodestar Licensing Group on Nov. 3 for "Apparatuses including capacitors including multiple dielectric materials" (Idaho Inventor)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,310, issued on Nov. 3, was assigned to Lodestar Licensing Group LLC (Evanston, Ill.). "Apparatuses including capacitors including multiple d... Read More


US Patent Issued to Tokyo Electron on Nov. 3 for "Substrate processing method and substrate processing apparatus" (Japanese Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,311, issued on Nov. 3, was assigned to Tokyo Electron Ltd. (Tokyo). "Substrate processing method and substrate processing apparatus" was inv... Read More


US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING, TSMC CHINA on Nov. 3 for "Method for manufacturing capacitor structure" (Chinese Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,312, issued on Nov. 3, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan) and TSMC CHINA COMPANY Ltd. (Shangha... Read More


US Patent Issued to SUMITOMO ELECTRIC DEVICE INNOVATIONS on Nov. 3 for "Semiconductor device" (Japanese Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,313, issued on Nov. 3, was assigned to SUMITOMO ELECTRIC DEVICE INNOVATIONS INC. (Kanagawa, Japan). "Semiconductor device" was invented by Y... Read More