US Patent Issued to SAMSUNG ELECTRONICS on Nov. 3 for "Stack semiconductor package" (South Korean Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,305, issued on Nov. 3, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Stack semiconductor package" was invented by Hyunsoo Chung (Suwon-si, South Korea), Joonghyun Baek (Suwon-si, South Korea), Hyungu Kang (Suwon-si, South Korea), Taeyoung Kim (Suwon-si, South Korea), Jaekyu Sung (Suwon-si, South Korea) and Cheolwoo Lee (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A stack semiconductor package including a base chip, at least two semiconductor chips stacked on the base chip, and a sealing material sealing the at least two semiconductor chips on the base chip may be provided. The at least two semiconduct...