ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,149, issued on Nov. 3, was assigned to ALL BEST PRECISION TECHNOLOGY Co. LTD. (Taoyuan City, Taiwan). "Loopback module" was invented by Have... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,150, issued on Nov. 3, was assigned to BULL SAS (Les Clayes-sous-Bois, France). "Electronic board equipped with a heat dissipation device an... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,152, issued on Nov. 3, was assigned to Telefonaktiebolaget LM Ericsson (publ) (Stockholm). "Method of producing a PCB, as well as a PCB, and... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,154, issued on Nov. 3, was assigned to Dell Products LP (Round Rock, Texas). "Conductive leak barriers to protect sensitive circuitry" was i... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,156, issued on Nov. 3, was assigned to Murata Manufacturing Co. Ltd. (Kyoto, Japan). "Circuit module" was invented by Tsuyoshi Takakura (Kyo... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,157, issued on Nov. 3, was assigned to Samsung Electro-Mechanics Co. Ltd. (Suwon-si, South Korea). "Circuit board" was invented by Ho-Jae Le... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,158, issued on Nov. 3, was assigned to MEC ADDHEAT (KAIPING) Co. LTD. (Kaiping City, China). "Anti-break structure for setting buffer sheets... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,159, issued on Nov. 3, was assigned to NGK ELECTRONICS DEVICES INC. (Mine, Japan) and NGK INSULATORS Ltd. (Nagoya, Japan). "Ceramic wiring m... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,160, issued on Nov. 3, was assigned to JOHNAN Corp. (Uji, Japan). "Circuit board" was invented by Yoshinari Matsuda (Uji, Japan), Kazuhiro K... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,161, issued on Nov. 3, was assigned to CelLink Corp. (San Carlos, Calif.). "Flexible interconnect circuits and methods of fabrication thereo... Read More