ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,751,327, issued on Sept. 29, was assigned to GlobalFoundries U.S. Inc. (Malta, N.Y.). "Stress-reduction structures for a compound semiconducto... और पढ़ें
ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,751,328, issued on Sept. 29, was assigned to Adeia Semiconductor Bonding Technologies Inc. (San Jose, Calif.). "Direct hybrid bond pad having ... और पढ़ें
ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,751,329, issued on Sept. 29, was assigned to CreeLED Inc. (Durham, N.C.). "Edge-emitting semiconductor devices and related methods" was invent... और पढ़ें
ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,751,330, issued on Sept. 29, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Semiconductor package" was invented by Cha... और पढ़ें
ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,751,331, issued on Sept. 29, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor chip, semiconductor device, ... और पढ़ें
ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,751,333, issued on Sept. 29, was assigned to Rohm Co. Ltd. (Kyoto, Japan). "Semiconductor device" was invented by Isamu Nishimura (Kyoto, Japa... और पढ़ें
ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,751,334, issued on Sept. 29, was assigned to Samsung Display Co. LTD. (Gyeonggi-do, South Korea). "Display apparatus and method of manufacturi... और पढ़ें
ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,751,335, issued on Sept. 29, was assigned to MACRONIX INTERNATIONAL Co. LTD. (Hsinchu, Taiwan). "Memory device" was invented by Shih-Hung Chen... और पढ़ें
ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,751,337, issued on Sept. 29, was assigned to Monolithic Power Systems Inc. (Kirkland, Wash.). "Double-side-cooling power module" was invented ... और पढ़ें
ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,751,338, issued on Sept. 29, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Packaged integrated circuit devices with e... और पढ़ें