US Patent Issued to SAMSUNG ELECTRONICS on Sept. 29 for "Semiconductor package" (South Korean Inventors)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,751,330, issued on Sept. 29, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Semiconductor package" was invented by Chajea Jo (Suwon-si, South Korea), Dohyun Kim (Suwon-si, South Korea) and SeungRyong Oh (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed is a semiconductor package including a substrate, a first semiconductor chip on the substrate and including a through via in the first semiconductor chip and a plurality of first bonding pads on an upper portion of the first semiconductor chip, a second semiconductor chip on the first semiconductor chip and including a plurality of second bonding pads...