US Patent Issued to Adeia Semiconductor Bonding Technologies on Sept. 29 for "Direct hybrid bond pad having tapered sidewall" (California, North Carolina Inventors)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,751,328, issued on Sept. 29, was assigned to Adeia Semiconductor Bonding Technologies Inc. (San Jose, Calif.).

"Direct hybrid bond pad having tapered sidewall" was invented by Pawel Mrozek (San Jose, Calif.) and Gaius Gillman Fountain Jr. (Youngsville, N.C.).

According to the abstract* released by the U.S. Patent & Trademark Office: "An element, a bonded structure that includes the element, and methods of forming the same are disclosed. The element can include a nonconductive field region having a surface defining at least a portion of a bonding surface of the element. The surface of the nonconductive field region is prepared for direct bonding. The element can also include a conduc...