US Patent Issued to SAMSUNG ELECTRONICS on Sept. 22 for "Semiconductor device including source/drain pattern with main layer and buffer layer having germanium and method of fabricating the same" (South Korean Inventors)

Posted On: 2026-09-24

ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,452, issued on Sept. 22, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor device including source/drai... Read More

US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Sept. 22 for "Integrated circuit driver device, layout, and method" (Taiwanese Inventors)

Posted On: 2026-09-24

Government News US Fed News Patentwipo

ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,453, issued on Sept. 22, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Integrated circuit driver dev... Read More

US Patent Issued to Taiwan Semiconductor Manufacturing on Sept. 22 for "Single metal gate with dual effective work function gate metal scheme" (Taiwanese Inventors)

Posted On: 2026-09-24

Government News US Fed News Patentwipo

ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,454, issued on Sept. 22, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Single metal gate with dual effec... Read More

US Patent Issued to X-FAB FRANCE on Sept. 22 for "Semiconductor fabrication process" (French Inventors)

Posted On: 2026-09-24

Government News US Fed News Patentwipo

ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,455, issued on Sept. 22, was assigned to X-FAB FRANCE SAS (Corbeil-Essonnes, France). "Semiconductor fabrication process" was invented by ... Read More

US Patent Issued to Enkris Semiconductor (Wuxi) on Sept. 22 for "Composite substrate, manufacturing method thereof and semiconductor device" (Chinese Inventor)

Posted On: 2026-09-24

Government News US Fed News Patentwipo

ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,456, issued on Sept. 22, was assigned to Enkris Semiconductor (Wuxi) Ltd. (Wuxi, China). "Composite substrate, manufacturing method thereo... Read More

US Patent Issued to MURATA MANUFACTURING on Sept. 22 for "Support substrate for passive electronic component, passive electronic component, semiconductor device, matching circuit, and filter circuit" (Japanese Inventors)

Posted On: 2026-09-24

Government News US Fed News Patentwipo

ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,457, issued on Sept. 22, was assigned to MURATA MANUFACTURING Co. LTD. (Nagaokakyo, Japan). "Support substrate for passive electronic comp... Read More

US Patent Issued to Samsung Display on Sept. 22 for "Display device including a light emitting element connected to a first pad electrode and a second pad electrode and manufacturing method thereof" (South Korean Inventors)

Posted On: 2026-09-24

Government News US Fed News Patentwipo

ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,458, issued on Sept. 22, was assigned to Samsung Display Co. Ltd. (Yongin-si, South Korea). "Display device including a light emitting ele... Read More

US Patent Issued to Wuhan China Star Optoelectronics Technology on Sept. 22 for "Array substrate with thin film transistor of vertical structure and display panel thereof" (Chinese Inventor)

Posted On: 2026-09-24

Government News US Fed News Patentwipo

ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,459, issued on Sept. 22, was assigned to Wuhan China Star Optoelectronics Technology Co. Ltd. (Wuhan, China). "Array substrate with thin f... Read More

US Patent Issued to BOE Technology Group on Sept. 22 for "Display substrate with multiple different circuit regions and preparation method therefor, and display apparatus" (Chinese Inventors)

Posted On: 2026-09-24

Government News US Fed News Patentwipo

ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,460, issued on Sept. 22, was assigned to BOE Technology Group Co. Ltd. (Beijing). "Display substrate with multiple different circuit regio... Read More

US Patent Issued to Taiwan Semiconductor Manufacturing on Sept. 22 for "Transistor contacts and methods of forming thereof" (Taiwanese Inventors)

Posted On: 2026-09-24

Government News US Fed News Patentwipo

ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,461, issued on Sept. 22, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Transistor contacts and methods o... Read More

Exclusive

Category

Source

Publication

Byline

Location

US Patent Issued to SAMSUNG ELECTRONICS on Sept. 22 for "Semiconductor device including source/drain pattern with main layer and buffer layer having germanium and method of fabricating the same" (South Korean Inventors)

US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Sept. 22 for "Integrated circuit driver device, layout, and method" (Taiwanese Inventors)

US Patent Issued to Taiwan Semiconductor Manufacturing on Sept. 22 for "Single metal gate with dual effective work function gate metal scheme" (Taiwanese Inventors)

US Patent Issued to X-FAB FRANCE on Sept. 22 for "Semiconductor fabrication process" (French Inventors)

US Patent Issued to Enkris Semiconductor (Wuxi) on Sept. 22 for "Composite substrate, manufacturing method thereof and semiconductor device" (Chinese Inventor)

US Patent Issued to MURATA MANUFACTURING on Sept. 22 for "Support substrate for passive electronic component, passive electronic component, semiconductor device, matching circuit, and filter circuit" (Japanese Inventors)

US Patent Issued to Samsung Display on Sept. 22 for "Display device including a light emitting element connected to a first pad electrode and a second pad electrode and manufacturing method thereof" (South Korean Inventors)

US Patent Issued to Wuhan China Star Optoelectronics Technology on Sept. 22 for "Array substrate with thin film transistor of vertical structure and display panel thereof" (Chinese Inventor)

US Patent Issued to BOE Technology Group on Sept. 22 for "Display substrate with multiple different circuit regions and preparation method therefor, and display apparatus" (Chinese Inventors)

US Patent Issued to Taiwan Semiconductor Manufacturing on Sept. 22 for "Transistor contacts and methods of forming thereof" (Taiwanese Inventors)