India, March 3 -- TrendForce's latest findings reveal that the expansion of AI applications from LLM training to inference has prompted CSPs to broaden data center build-outs beyond AI servers to incl... और पढ़ें
India, March 3 -- Firebird, a U.S.-based AI cloud and infrastructure company, announced Phase Two of its AI supercomputing megaproject, securing U.S. export licensing and regulatory approvals for the ... और पढ़ें
India, March 3 -- Global CSPs are accelerating investment in AI servers and infrastructure to support expanding AI deployment and upgrades, according to TrendForce's latest findings on the AI server m... और पढ़ें
India, March 2 -- India's AI ambitions are rapidly shifting from policy conversations to large-scale infrastructure buildouts, as demand for sovereign compute, localised cloud, and high-performance GP... और पढ़ें
India, March 2 -- Government of Gujarat's Department of Science & Technology and the Gujarat State Electronics Mission successfully inaugurated the Gujarat SemiConnect 2026 event. Ashok Chandak, Pres... और पढ़ें
India, March 2 -- India Electronics and Semiconductor Association (IESA) successfully concluded the IESA Vision Summit 2026, marking a pivotal moment in India's ascent as a global semiconductor powerh... और पढ़ें
India, March 2 -- Narendra Sen, Founder & CEO, RackBank & NeevCloud takes us on a walk through the fresh data centre landscape in India- showing us how 100 kW to 150 kW per rack densities, significanc... और पढ़ें
India, March 2 -- India Electronics and Semiconductor Association (IESA) congratulated the Government of India and Micron Technology on the historic inauguration of Micron's state-of-the-art ATMP (Ass... और पढ़ें
India, March 2 -- Micron Technology Inc. celebrated the grand opening of its semiconductor assembly and test facility in Sanand, Gujarat, India. The state-of-the-art facility converts advanced DRAM a... और पढ़ें
India, March 2 -- The 1st International Electronics, Packaging, Design, and Manufacturing Conference 2026 was held today in Faridabad, under the mentorship of IEEE Electronics Packaging Society. Deli... और पढ़ें