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Deca and Silicon Storage announce strategic collaboration to enable NVM chiplet solutions

India, Sept. 12 -- As traditional monolithic chip designs grow in complexity and increase in cost, the interest and adoption of chiplet technology in the semiconductor industry also increases. Deca Te... Read More


Silex announces Wi-Fi 6E tri-band embedded module based on NXP IW623 chipset

India, Sept. 11 -- Silex Technology America, a global provider of secure and reliable wireless solutions, announced the launch of the SX-SDMAX6E, the embedded module based on NXP Semiconductors ' IW62... Read More


Redington, Google and CIMSME comes together for MSME digital transformation

India, Sept. 11 -- Redington, Google, and CIMSME have joined forces to accelerate digital transformation for India's MSMEs. Through affordable cloud solutions, AI-powered tools, and capacity-building ... Read More


Intel collaborates with LG Innotek to implement an AI-powered smart factory

India, Sept. 11 -- In the world of precision component manufacturing - just think of the tiny parts in modern cell phones, vehicle displays, and other smart devices - reproducing the same part hundred... Read More


OpenAI and Oracle signed USD 300 billion computing deal

India, Sept. 11 -- OpenAI has reportedly confirmed the signing of a staggering USD 300 billion deal with Oracle to purchase a massive amount of computing power. The purchase will be concluded over a p... Read More


How the HIRE Act, a proposed 25% US outsourcing tax, threatens India's IT

India, Sept. 10 -- A new US Senate proposal, the Halting International Relocation of Employment (HIRE) Act, threatens to upend India's USD 224 billion IT export market. With a proposed 25% excise tax ... Read More


SAL receives Applied Materials PECVD tool for 200mm dielectrics thin films deposition

India, Sept. 10 -- Silicon Austria Labs (SAL) has received its Centura PECVD tool from Applied Materials, supporting dielectrics deposition for RF circulators on 200mm wafers. The tool is in commissio... Read More


AGC participating in "JOINT3" Consortium to develop next-gen semiconductor packaging

India, Sept. 10 -- AGC Inc. has joined the "JOINT3" Consortium to develop next-generation semiconductor packaging. JOINT3 is a co-creation evaluation framework established by Resonac, with the aim of... Read More


3DIC Advanced Packaging Manufacturing Alliance to become a force

India, Sept. 10 -- SEMICON Taiwan 2025 will debut in September. With the sharp increase in demand for AI chips and HPC, the global semiconductor industry is ushering in a new generation of advanced pa... Read More


Top 10 jobs most likely to be replaced by AI by 2030: AI Automation Risk Report

India, Sept. 10 -- Artificial Intelligence (AI) is no longer a futuristic concept -it is already influencing industries, transforming economies, and redefining the global workforce. According to recen... Read More