US Patent Issued to JFE STEEL on May 26 for "Method for manufacturing press formed article and press forming device" (Japanese Inventor)

ALEXANDRIA, Va., May 26 -- United States Patent no. 12,636,696, issued on May 26, was assigned to JFE STEEL Corp. (Tokyo). "Method for manufacturing press formed article and press forming device" was... Read More

US Patent Issued to Aptiv Manufacturing Management Services on May 26 for "Apparatus and method for twisting wires" (Polish Inventors)

ALEXANDRIA, Va., May 26 -- United States Patent no. 12,636,697, issued on May 26, was assigned to Aptiv Manufacturing Management Services GmbH (Schaffhausen, Switzerland). "Apparatus and method for t... Read More

US Patent Issued to TUSAS-TURK HAVACILIK VE UZAY SANAYII on May 26 for "Manufacturing system" (Turkish Inventor)

ALEXANDRIA, Va., May 26 -- United States Patent no. 12,636,698, issued on May 26, was assigned to TUSAS-TURK HAVACILIK VE UZAY SANAYII A.S. (Ankara, Turkey). "Manufacturing system" was invented by Mu... Read More

US Patent Issued to TEMPUS STEEL on May 26 for "Structure of carbide steel rod embedded in steel matrix and composite casting process" (Chinese Inventor)

ALEXANDRIA, Va., May 26 -- United States Patent no. 12,636,699, issued on May 26, was assigned to TEMPUS STEEL LTD (Ningxiang, China). "Structure of carbide steel rod embedded in steel matrix and com... Read More

US Patent Issued to MITSUI KINZOKU on May 26 for "Conductive composition for bonding, bonding structure using same, and manufacturing method thereof" (Japanese Inventors)

ALEXANDRIA, Va., May 26 -- United States Patent no. 12,636,700, issued on May 26, was assigned to MITSUI KINZOKU COMPANY Ltd. (Japan). "Conductive composition for bonding, bonding structure using sam... Read More

US Patent Issued to LG Electronics, RESEARCH & BUSINESS FOUNDATION SUNGKYUNKWAN UNIVERSITY on May 26 for "Alloy powder and preparation method therefor" (South Korean Inventors)

ALEXANDRIA, Va., May 26 -- United States Patent no. 12,636,701, issued on May 26, was assigned to LG Electronics Inc. (Seoul, South Korea) and RESEARCH & BUSINESS FOUNDATION SUNGKYUNKWAN UNIVERSITY (G... Read More

US Patent Issued to REALIZER on May 26 for "Calibration of a system for selective powder melting" (German Inventors)

ALEXANDRIA, Va., May 26 -- United States Patent no. 12,636,702, issued on May 26, was assigned to REALIZER GMBH (Borchen, Germany). "Calibration of a system for selective powder melting" was invented... Read More

US Patent Issued to GE VERNOVA INFRASTRUCTURE TECHNOLOGY on May 26 for "Cavity plug additive part removal from build plate" (American, Seychellois Inventors)

ALEXANDRIA, Va., May 26 -- United States Patent no. 12,636,703, issued on May 26, was assigned to GE VERNOVA INFRASTRUCTURE TECHNOLOGY LLC (Greenville, S.C.). "Cavity plug additive part removal from ... Read More

US Patent Issued to XI'AN UNIVERSITY OF TECHNOLOGY on May 26 for "Conformal printing device for curved-surface circuits" (Chinese Inventors)

ALEXANDRIA, Va., May 26 -- United States Patent no. 12,636,704, issued on May 26, was assigned to XI'AN UNIVERSITY OF TECHNOLOGY (Xi'an, China). "Conformal printing device for curved-surface circuits... Read More

US Patent Issued to Velo3D on May 26 for "Device for planarization of a surface of a material bed" (California, New Mexico Inventors)

ALEXANDRIA, Va., May 26 -- United States Patent no. 12,636,705, issued on May 26, was assigned to Velo3D Inc. (Campbell, Calif.). "Device for planarization of a surface of a material bed" was invente... Read More

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