US Patent Issued to MITSUI KINZOKU on May 26 for "Conductive composition for bonding, bonding structure using same, and manufacturing method thereof" (Japanese Inventors)

ALEXANDRIA, Va., May 26 -- United States Patent no. 12,636,700, issued on May 26, was assigned to MITSUI KINZOKU COMPANY Ltd. (Japan).

"Conductive composition for bonding, bonding structure using same, and manufacturing method thereof" was invented by Satoshi Konno (Ageo, Japan), Shinichi Yamauchi (Ageo, Japan) and Kei Anai (Ageo, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A conductive composition for bonding includes a mix of copper powder carboxylic acid. The carboxylic acid has a branched carbon chain. The copper powder comprises first and second copper particles. The first copper particles have a volume-based cumulative particle size D50 of 0.11 micro metre or more and less than 1 micro metre a...