US Patent Issued to GE VERNOVA INFRASTRUCTURE TECHNOLOGY on May 26 for "Cavity plug additive part removal from build plate" (American, Seychellois Inventors)

ALEXANDRIA, Va., May 26 -- United States Patent no. 12,636,703, issued on May 26, was assigned to GE VERNOVA INFRASTRUCTURE TECHNOLOGY LLC (Greenville, S.C.).

"Cavity plug additive part removal from build plate" was invented by Brian E. Burton (Greenville, Seychelles) and Timothy M. Moricca (Greenville, S.C.).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present application provides a cavity plug for a cavity extending through a first wall of a component manufactured in an additive manufacturing system. The cavity plug may include an outer shell, a first seal sized to seal about the cavity extending through the first wall of the component, and a locking mechanism positioned within the outer shell. The lo...