US Patent Issued to UNITED MICROELECTRONICS on June 16 for "Semiconductor structure and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,705, issued on June 16, was assigned to UNITED MICROELECTRONICS CORP. (Hsin-Chu City, Taiwan). "Semiconductor structure and manufacturing m... Read More

US Patent Issued to SAMSUNG ELECTRONICS on June 16 for "Semiconductor package" (South Korean Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,706, issued on June 16, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Semiconductor package" was invented by Joo-Y... Read More

US Patent Issued to Taiwan Semiconductor Manufacturing on June 16 for "Semiconductor device including molded die stack and methods of forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,707, issued on June 16, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Semiconductor device including mold... Read More

US Patent Issued to SAMSUNG ELECTRONICS on June 16 for "Method, apparatus, and system with integrated circuit manufacturing" (South Korean Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,708, issued on June 16, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Method, apparatus, and system with integrate... Read More

US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on June 16 for "Integrated circuit device and method of manufacturing" (Taiwanese Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,709, issued on June 16, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Integrated circuit device and m... Read More

US Patent Issued to Huawei Technologies'Co., 'Ltd.' on June 16 for "Chip stacking structure and manufacturing method thereof, chip package structure, and electronic device" (Chinese Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,710, issued on June 16, was assigned to Huawei Technologies'Co.'Ltd.' (Shenzhen, China). "Chip stacking structure and manufacturing method ... Read More

US Patent Issued to SAMSUNG ELECTRONICS on June 16 for "Chip stack structure and semiconductor package including the same" (South Korean Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,711, issued on June 16, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea). "Chip stack structure and semiconductor pa... Read More

US Patent Issued to National Yang Ming Chiao Tung University on June 16 for "Electrical connection and forming method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,712, issued on June 16, was assigned to National Yang Ming Chiao Tung University (Hsinchu City, Taiwan). "Electrical connection and forming... Read More

US Patent Issued to SAMSUNG ELECTRONICS on June 16 for "Semiconductor devices including bonded semiconductor layers and manufacturing methods of the same" (South Korean Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,713, issued on June 16, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Semiconductor devices including bonded semic... Read More

US Patent Issued to SAMSUNG ELECTRONICS on June 16 for "Semiconductor package including connection of dummy pad and test pad" (South Korean Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,714, issued on June 16, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Semiconductor package including connection o... Read More

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