ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,705, issued on June 16, was assigned to UNITED MICROELECTRONICS CORP. (Hsin-Chu City, Taiwan).
"Semiconductor structure and manufacturing method thereof" was invented by Chiu-Te Lee (Hsinchu County, Taiwan), Wen-Fang Lee (Hsinchu City, Taiwan), Shan-Shi Huang (Hsinchu City, Taiwan) and Kuan-Chuan Chen (Taichung City, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "The invention provides a semiconductor structure, which comprises a first silicon substrate with a display region and a driving region defined thereon, a circuit layer located on the first silicon substrate, a plurality of light emitting elements located on the display region of the ...