US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on June 16 for "Integrated circuit device and method of manufacturing" (Taiwanese Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,709, issued on June 16, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Integrated circuit device and method of manufacturing" was invented by Yung-Chin Hou (Hsinchu, Taiwan), Lee-Chung Lu (Hsinchu, Taiwan), Yi-Kan Cheng (Hsinchu, Taiwan), Jiann-Tyng Tzeng (Hsinchu, Taiwan), Wei-Cheng Lin (Hsinchu, Taiwan), Ching-Yu Huang (Hsinchu, Taiwan) and Chun-Yen Lin (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An integrated circuit (IC) device includes a bottom semiconductor device, a top semiconductor device over the bottom semiconductor device in a thickness direction of the IC device, and a multilayer ...