US Patent Issued to SAMSUNG ELECTRONICS on April 14 for "Semiconductor package and method of fabricating the same" (South Korean Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,768, issued on April 14, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea). "Semiconductor package and method of fab... और पढ़ें

US Patent Issued to SAMSUNG ELECTRONICS on April 14 for "Semiconductor package and method of fabricating the same" (South Korean Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,768, issued on April 14, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea). "Semiconductor package and method of fab... और पढ़ें

US Patent Issued to LG Display on April 14 for "Backlight unit and display device including the same" (South Korean Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,769, issued on April 14, was assigned to LG Display Co. Ltd. (Seoul, South Korea). "Backlight unit and display device including the same" ... और पढ़ें

US Patent Issued to LG Display on April 14 for "Backlight unit and display device including the same" (South Korean Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,769, issued on April 14, was assigned to LG Display Co. Ltd. (Seoul, South Korea). "Backlight unit and display device including the same" ... और पढ़ें

US Patent Issued to SAMSUNG ELECTRONICS on April 14 for "Semiconductor package" (South Korean Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,770, issued on April 14, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor package" was invented by Heu... और पढ़ें

US Patent Issued to SAMSUNG ELECTRONICS on April 14 for "Semiconductor package" (South Korean Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,770, issued on April 14, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor package" was invented by Heu... और पढ़ें

US Patent Issued to Adeia Semiconductor Bonding Technologies on April 14 for "Direct bonding methods and structures" (California, North Carolina Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,771, issued on April 14, was assigned to Adeia Semiconductor Bonding Technologies Inc. (San Jose, Calif.). "Direct bonding methods and str... और पढ़ें

US Patent Issued to Adeia Semiconductor Bonding Technologies on April 14 for "Direct bonding methods and structures" (California, North Carolina Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,771, issued on April 14, was assigned to Adeia Semiconductor Bonding Technologies Inc. (San Jose, Calif.). "Direct bonding methods and str... और पढ़ें

US Patent Issued to Lumileds Singapore on April 14 for "LED electrical contact for 3D LEDs" (German, Dutch Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,772, issued on April 14, was assigned to Lumileds Singapore Pte. Ltd. (Singapore). "LED electrical contact for 3D LEDs" was invented by Er... और पढ़ें

US Patent Issued to Lumileds Singapore on April 14 for "LED electrical contact for 3D LEDs" (German, Dutch Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,772, issued on April 14, was assigned to Lumileds Singapore Pte. Ltd. (Singapore). "LED electrical contact for 3D LEDs" was invented by Er... और पढ़ें

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