US Patent Issued to Adeia Semiconductor Bonding Technologies on April 14 for "Direct bonding methods and structures" (California, North Carolina Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,771, issued on April 14, was assigned to Adeia Semiconductor Bonding Technologies Inc. (San Jose, Calif.).

"Direct bonding methods and structures" was invented by Cyprian Emeka Uzoh (San Jose, Calif.), Jeremy Alfred Theil (Mountain View, Calif.), Gaius Gillman Fountain Jr. (Youngsville, N.C.) and Dominik Suwito (San Jose, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed herein are methods for direct bonding. In some embodiments, the direct bonding method includes providing a first element having a first bonding surface, providing a second element having a second bonding surface, slightly etching the first bonding surface, treating th...