US Patent Issued to SAMSUNG ELECTRONICS on April 14 for "Semiconductor package and method of fabricating the same" (South Korean Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,768, issued on April 14, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea).

"Semiconductor package and method of fabricating the same" was invented by Choong Bin Yim (Seoul, South Korea), Ji Hwang Kim (Cheonan-si, South Korea), Jin-Woo Park (Seoul, South Korea) and Jong Bo Shim (Anyang-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a first wiring structure which includes a first insulating layer, and a first wiring pad inside the first insulating layer, a first semiconductor chip on the first wiring structure, a second wiring structure on the first semiconductor chip, and a conn...