ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,995, issued on June 23, was assigned to Yangtze Memory Technologies Co. Ltd. (Wuhan, China). "Package structure" was invented by Li Tao (Wu... Read More
ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,996, issued on June 23, was assigned to STMicroelectronics Pte Ltd (Singapore). "Passivation layer for an integrated circuit device that pr... Read More
ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,997, issued on June 23, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Semiconductor structure and met... Read More
ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,998, issued on June 23, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Semiconductor device and manufactur... Read More
ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,999, issued on June 23, was assigned to Mitsubishi Electric Corp. (Tokyo). "Semiconductor device and method of manufacturing semiconductor ... Read More
ALEXANDRIA, Va., July 15 -- United States Patent no. 12,667,000, issued on June 23, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Semiconductor device that uses bond... Read More
ALEXANDRIA, Va., July 15 -- United States Patent no. 12,667,001, issued on June 23, was assigned to Intel Corp. (Santa Clara, Calif.). "Integrated packaging architecture with solder and non-solder in... Read More
ALEXANDRIA, Va., July 15 -- United States Patent no. 12,667,002, issued on June 23, was assigned to Seoul Viosys Co. Ltd. (Gyeonggi-do, South Korea). "Light emitting device and light emitting module ... Read More
ALEXANDRIA, Va., July 15 -- United States Patent no. 12,667,003, issued on June 23, was assigned to SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY Co. LTD. (Shenzhen, China). "L... Read More
ALEXANDRIA, Va., July 15 -- United States Patent no. 12,667,004, issued on June 23, was assigned to CHANGXIN MEMORY TECHNOLOGIES INC. (Hefei City, China). "Semiconductor package" was invented by Xiao... Read More