US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on June 23 for "Semiconductor structure and method for forming the same" (Taiwanese Inventor)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,997, issued on June 23, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Semiconductor structure and method for forming the same" was invented by Jen-Yuan Chang (Hsinchu City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor structure is provided, and includes a substrate and a plurality of devices disposed over the substrate. The semiconductor structure includes an interconnect structure disposed over the substrate and electronically connected to the devices. The semiconductor structure also includes a bonding film formed over the interconnect structure. The semiconductor structure further inc...