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US Patent Issued to CHANGXIN MEMORY TECHNOLOGIES on July 21 for "Semiconductor structure for reducing RLC parasitic parameters and manufacturing method thereof" (Chinese Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,439, issued on July 21, was assigned to CHANGXIN MEMORY TECHNOLOGIES INC. (Hefei City, China). "Semiconductor structure for reducing RLC pa... Read More


US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on July 21 for "Three-dimensional integrated circuit with hybrid bond metal structure" (Taiwanese Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,440, issued on July 21, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Three-dimensional integrated ci... Read More


US Patent Issued to Renesas Electronics on July 21 for "Semiconductor device and method of manufacturing the same" (Japanese Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,441, issued on July 21, was assigned to Renesas Electronics Corp. (Tokyo). "Semiconductor device and method of manufacturing the same" was ... Read More


US Patent Issued to Intel on July 21 for "Replacement via and buried or backside power rail" (American, German Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,442, issued on July 21, was assigned to Intel Corp. (Santa Clara, Calif.). "Replacement via and buried or backside power rail" was invented... Read More


US Patent Issued to INTERNATIONAL BUSINESS MACHINES on July 21 for "Self-aligned backside contact with increased contact area" (New York Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,443, issued on July 21, was assigned to INTERNATIONAL BUSINESS MACHINES Corp. (Armonk, N.Y.). "Self-aligned backside contact with increased... Read More


US Patent Issued to Intel on July 21 for "Inline circuit edit for backside power delivery" (Oregon Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,444, issued on July 21, was assigned to Intel Corp. (Santa Clara, Calif.). "Inline circuit edit for backside power delivery" was invented b... Read More


US Patent Issued to International Business Machines on July 21 for "Semiconductor device including backside signal wiring and frontside power supply" (New York Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,445, issued on July 21, was assigned to International Business Machines Corp. (Armonk, N.Y.). "Semiconductor device including backside sign... Read More


US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on July 21 for "Semiconductor device including through via and method of making" (Taiwanese Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,446, issued on July 21, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Semiconductor device including ... Read More


US Patent Issued to TEXAS INSTRUMENTS on July 21 for "Common mode suppression circuit" (Belarusian, American Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,447, issued on July 21, was assigned to TEXAS INSTRUMENTS Inc. (Dallas). "Common mode suppression circuit" was invented by Siraj Akhtar (Da... Read More


US Patent Issued to SAMSUNG ELECTRONICS on July 21 for "Integrated circuit device and electronic device including the same" (South Korean Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,448, issued on July 21, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Integrated circuit device and electronic dev... Read More